We offer leading edge electronic manufacturing & electronics assembly
No matter how small or complex of a project you are looking to have completed, we will work closely with you every step of the way to ensure that your exact industry requirements are being properly met.
At Link2 Manufacturing, we offer a wide range of equipment capabilities for all kinds of projects and industries. We are also always ready to answer any questions or concerns you might have about design for manufacturing, cost targets, risk avoidance, regulatory compliance, and a host of other product and industry-related requirements.
Printer—DEK (ASM), S25—Siplace (Siemens), E-Series—Siplace (Siemens), D1—Siplace (Siemens), Vitronics Soltec Reflow Oven—10 zone, Printer – DEK (ASM), Cs—Siplace (Siemens), CF—Siplace (Siemens), Vitronics Soltec Reflow Oven—XPM2—8 zone.
Faxitron CS-100AC is a real-time imaging system designed for the inspection of SMT assemblies, semiconductors, and PCBs. This system provides the advantages of real-time defect detection for electronics production, quality control, and failure analysis applications.
Printers—DEK (ASM)—inline automated solder paste printer for repeatable high-quality prints with onboard 2D inspection utilized.
Vitronics Soltec reflow oven—10 zone—and Vitronics Soltec reflow oven—XPM2—8 zone—are designed for reliable lead-free processing.
Viscom Vision Technology S3088, Ultra Chrome.
Aqueous Technologies Trident III automated defluxing system is capable of removing rosins, no-cleans, and water-soluble fluxes.
Ultra-Sonic by Aqueous Technologies.
Ace Kiss 102IL for through hole applications.
PVA-2000 is a 5-axis, fully automated conformal coating machine loaded with Dow Corning 1-2620 silicone.
Dr. Storage—Component Bake Oven Storage
Yamato—Component Bake Oven
ISM Ultra Flex 3600
ISM 500
ISM 2000
Full functional testing to ensure 100% yield and ready to ship.
Cable assemblies and final packaging for a total product solution.
SRT Sierra Summit series rework machine for high-complexity repairs, including BGA's, QFN's, LGA's, and high-density connectors.
Design for manufacturing support for new product introductions.